President Biden Signs AI EO / POTUS Twitter

The White House announced a new framework today that aims to maintain U.S. leadership in AI by keeping advanced computing chips and AI models under the control of the United States and its allies. […]

The Department of Commerce (DoC) has finalized an agreement with Hemlock Semiconductor (HSC) for up to $325 million in direct funding under the CHIPS and Science Act to aid in the construction of a new semiconductor-grade polysilicon manufacturing facility.   […]

semiconductor chips

The Department of Commerce and its Natcast nonprofit have designated Arizona State University (ASU) Research Park as the third location in the U.S. for establishment of a CHIPS for America research and development center.  […]

The Department of Commerce announced on Jan. 6 that it finalized $285 million in CHIPS for America funding for developing and operating a new semiconductor development facility in North Carolina that will take a “digital twins” approach.    […]

semiconductor

The Biden administration’s top economic advisor is praising progress made in strengthening semiconductor supply chains over the last few years and urging President-elect Donald Trump’s team to maintain efforts to strengthen those supply chains. […]

semiconductor chips

The Department of Commerce said on Dec. 18 that it finalized an award of up to $406 million of direct funding to GlobalWafers Co. Ltd. under the CHIPS and Science Act to create semiconductor wafer operations in the United States.  […]

Gina Raimondo, Department of Commerce

The Department of Commerce’s Bureau of Industry and Security (BIS) announced a new package of export controls on Monday designed to further curb the People’s Republic of China’s (PRC) ability to make advanced-node semiconductors on its own. […]

The Biden-Harris administration announced today that the Department of Commerce has awarded TSMC Arizona Corporation up to $6.6 billion in direct funding under the CHIPS and Science Act – the first major award finalized under the $52 billion program. […]

semiconductor chips

The Department of Commerce (DoC) announced on Friday that it has signed two separate preliminary agreements under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding. […]

semiconductor

The Department of Commerce (DoC) announced Monday it has reached a preliminary agreement with Hemlock Semiconductor (HSC) for up to $325 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new semiconductor-grade polysilicon manufacturing facility on HSC’s existing campus in Hemlock, Mich. […]

semiconductor chips

The National Institute of Standards and Technology (NIST) announced Wednesday that it is opening a competition with $100 million in funding to demonstrate how AI tech can assist in developing new sustainable semiconductor materials that meet industry needs and can be adopted in five years. […]

semiconductor chips
semiconductor chips
semiconductor chips

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Rogue Valley Microdevices (RVM) for up to $6.7 million in direct funding under the CHIPS and Science Act to support the construction of a new semiconductor factory. […]

Treasury

The Department of Commerce announced today it has reached a preliminary agreement with Rocket Lab, the parent company of space power provider SolAero Technologies Corp., for up to $23.9 million in direct funding under the CHIPS and Science Act to expand the production of compound semiconductors that power spacecrafts and satellites. […]

semiconductor chips

The National Institute of Standards and Technology (NIST) is creating a new CHIPS Manufacturing USA institute that will use digital twins approaches to greatly speed the development and validation of next-generation semiconductor manufacturing, advanced packaging, assembly, and test processes. […]

Russia hack

Witnesses warned lawmakers at a Senate Homeland Security and Governmental Affairs subcommittee hearing on Feb. 27 that U.S.-made technology is getting into Russian military hands and weaponry despite sanctions in place aimed at preventing that from happening. […]

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White House

President Biden signed an executive order on August 9 that will give the Treasury Department the ability to block private-sector U.S. investments in China that involve hot-button technologies including artificial intelligence, quantum information science, and semiconductors and microelectronics. […]

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